1n5908 SM5908 transil tm ? unidirectional transil diode peak pulse power : 1500 w (10/1000 m s) reverse stand off voltage : 5 v low clamping factor fast response time ul recognized features cb429 smc symbol parameter value unit p pp peak pulse power dissipation (see note1) tj initial = t amb 1500 w p power dissipation on infinite heatsink t amb = 75 c5w i fsm non repetitive surge peak forward current for unidirectional types t p = 10ms t j initial = t amb 200 a t stg tj storage temperature range maximum junction temperature - 65 to + 175 175 c c t l maximum lead temperature for soldering during 10s (at 5mm from case for cb429) cb429 smc 230 260 c c note 1 : for a surge greater than the maximum values, the diode will fail in short-circuit. absolute maximum ratings (t amb = 25c). description the 1n5908 and SM5908 are dedicated to the 5 v logic circuit protection (ttl and cmos technologies). their low clamping voltage at high current level guarantees excellent protection for sensitive components. august 1999 ed : 2a symbol parameter value unit r th (j-l) junction to leads 20 c/w r th (j-a) junction to ambient on printed circuit. l lead = 10 mm cb429 75 c/w on recommended pad layout smc 75 c/w thermal resistances 1/6
i v f v i rm i pp v cl v br v rm i f symbol parameter v rm stand-off voltage v br breakdown voltage v cl clamping voltage i rm leakage current @ v rm i pp peak pulse current a t voltage temperature coefficient v f forward voltage electrical characteristics (t amb = 25c) types i rm @ v rm v br @ i r v cl @ i pp v cl @ i pp v cl @ i pp a tc max min max max max max typ note2 10/1000 m s 10/1000 m s 10/1000 m s note3 note4 m avvmavavava10 -4 / cpf 1n5908 SM5908 300 5 6 1 7.6 30 8 60 8.5 120 5.7 9500 fig. 1: peak pulse power dissipation versus initial junction temperature (printed circuit board). %i pp 10 s m 100 50 0 1000 s m t note 2 : pulse test : tp < 50ms note 3 : d v br = a t*(t amb -25)* v br (25c). note 4 : v r = 0v, f = 1 mhz 1n5908/SM5908 2/6
fig. 2 : peak pulse power versus exponential pulse duration. fig. 3 : clamping voltage versus peak pulse current. exponential waveform t p = 10 ms............... t p = 1 ms------------- t p = 20 m s________ note : the curves of the figure 3 are specified for a junction temperature of 25 c before surge. the given results may be extrapolated for other junction temperatures by using the following formula : d v br = a t * (t amb - 25) * v br (25c). 1n5908/SM5908 3/6
fig. 6b : smc package. mounting on fr4 pc board with recommended pad layout. fig. 5 : peak forward voltage drop versus peak forward current. fig. 6a : cb429 package. (for fr4 pc board with l lead = 10 mm) fig. 4 : capacitance versus reverse applied voltage (typical values). fig. 6a/6b : transient thermal impedance junction-ambient versus pulse duration. fig. 7 : relative variation of leakage current versus junction temperature. 1n5908/SM5908 4/6
package type marking smc SM5908 mdc cb429 1n5908 1n5908 a white band indicates the cathode marking : logo, type code and cathode band packaging : standard packaging is in tape and reel. package mechanical data smc (plastic) ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 d 5.55 6.25 0.218 0.246 l 0.75 1.60 0.030 0.063 weight = 0.25 g. foot print (in millimeters) order code 1n5908 rl sm 5908 packaging : = ammopack tape rl = tape and reel surface mount 2.0 4.2 2.0 3.3 e c l e2 e1 d a1 a2 b numerical code device code 1n5908/SM5908 5/6
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1999 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com cb429 (plastic) weight = 0.85 g. package mechanical data ref. dimensions millimeters inches min. typ. max. min. typ. max. a 9.45 9.50 9.80 0.372 0.374 0.386 b 26 1.024 ? c 4.90 5.00 5.10 0.193 0.197 0.201 ? d 0.94 1.00 1.06 0.037 0.039 0.042 l1 1.27 0.050 note : the lead is not controlled within zone l 1 packaging : standard packaging is in tape and reel. 1n5908/SM5908 6/6
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